Sunpump

Micro nano cross scale pump induced ultrafast laser ultrasound characterization system

Model:可定制
Micro nano cross scale pump induced ultrafast laser ultrasound characterization system
Micro nano cross scale pump induced ultrafast laser ultrasound characterization system
Micro nano cross scale pump induced ultrafast laser ultrasound characterization system
Micro nano cross scale pump induced ultrafast laser ultrasound characterization system
Micro nano cross scale pump induced ultrafast laser ultrasound characterization system

Overview

From femtosecond transient to encapsulation tomography, the acoustic, thermal, and electrical responses of micro nano structures can be visualized in one stop.

Targeting the research and development of third-generation semiconductors, high-density 3D ICs, intelligent piezoelectric/MEMS, and nanofilms, we integrate pump detection, in-situ multi field loading, fully focused imaging, and intelligent fusion analysis.

Non contact, non-destructive, in-situ ultrafast characterization system for advanced microelectronic devices

μ PULSE uses a pulse width adjustable ultrafast fiber laser as its core, which induces transient photothermal fields and ultrasonic responses through pumping, and reads electronic, thermal, and acoustic information at the picosecond to nanosecond scale; Simultaneously combining array acquisition, fully focused imaging, and multi-source synchronous analysis, achieve cross scale evaluation from nanofilm/heterojunction interfaces to 3D packaging structures.

Modular System Architecture: Integration of Excitation, Loading, Detection, Imaging, and Evaluation

激光波长: 1030 nm ± 10 nm;可扩展二倍频/三倍频 515 nm、343 nm 及 1064 nm
激光重频: 单次 - 100 kHz
单脉冲能量: 1 mJ @ 1030 nm
脉宽范围: 250 fs - 30 ps 可选
光束直径: 约 1.5 mm
脉冲能量稳定性: 连续工作4小时,< 1% @ 1064 nm
光束指向稳定性: < 50 μrad
光束质量: TEM00,M² < 1.5
偏振度: > 100:1
检测模式: Pump-Probe、TFM、相控阵/传感器阵列扩展、多源同步锁相分析

Description

From femtosecond transient to encapsulation tomography, the acoustic, thermal, and electrical responses of micro nano structures can be visualized in one stop.

Targeting the research and development of third-generation semiconductors, high-density 3D ICs, intelligent piezoelectric/MEMS, and nanofilms, we integrate pump detection, in-situ multi field loading, fully focused imaging, and intelligent fusion analysis.

Non contact, non-destructive, in-situ ultrafast characterization system for advanced microelectronic devices

μ PULSE uses a pulse width adjustable ultrafast fiber laser as its core, which induces transient photothermal fields and ultrasonic responses through pumping, and reads electronic, thermal, and acoustic information at the picosecond to nanosecond scale; Simultaneously combining array acquisition, fully focused imaging, and multi-source synchronous analysis, achieve cross scale evaluation from nanofilm/heterojunction interfaces to 3D packaging structures.

Modular System Architecture: Integration of Excitation, Loading, Detection, Imaging, and Evaluation

激光波长: 1030 nm ± 10 nm;可扩展二倍频/三倍频 515 nm、343 nm 及 1064 nm
激光重频: 单次 - 100 kHz
单脉冲能量: 1 mJ @ 1030 nm
脉宽范围: 250 fs - 30 ps 可选
光束直径: 约 1.5 mm
脉冲能量稳定性: 连续工作4小时,< 1% @ 1064 nm
光束指向稳定性: < 50 μrad
光束质量: TEM00,M² < 1.5
偏振度: > 100:1
检测模式: Pump-Probe、TFM、相控阵/传感器阵列扩展、多源同步锁相分析

Specifications

Single pulse energy1 mJ @ 1030 nm