



From femtosecond transient to encapsulation tomography, the acoustic, thermal, and electrical responses of micro nano structures can be visualized in one stop.
Targeting the research and development of third-generation semiconductors, high-density 3D ICs, intelligent piezoelectric/MEMS, and nanofilms, we integrate pump detection, in-situ multi field loading, fully focused imaging, and intelligent fusion analysis.
Non contact, non-destructive, in-situ ultrafast characterization system for advanced microelectronic devices
μ PULSE uses a pulse width adjustable ultrafast fiber laser as its core, which induces transient photothermal fields and ultrasonic responses through pumping, and reads electronic, thermal, and acoustic information at the picosecond to nanosecond scale; Simultaneously combining array acquisition, fully focused imaging, and multi-source synchronous analysis, achieve cross scale evaluation from nanofilm/heterojunction interfaces to 3D packaging structures.
Modular System Architecture: Integration of Excitation, Loading, Detection, Imaging, and Evaluation
From femtosecond transient to encapsulation tomography, the acoustic, thermal, and electrical responses of micro nano structures can be visualized in one stop.
Targeting the research and development of third-generation semiconductors, high-density 3D ICs, intelligent piezoelectric/MEMS, and nanofilms, we integrate pump detection, in-situ multi field loading, fully focused imaging, and intelligent fusion analysis.
Non contact, non-destructive, in-situ ultrafast characterization system for advanced microelectronic devices
μ PULSE uses a pulse width adjustable ultrafast fiber laser as its core, which induces transient photothermal fields and ultrasonic responses through pumping, and reads electronic, thermal, and acoustic information at the picosecond to nanosecond scale; Simultaneously combining array acquisition, fully focused imaging, and multi-source synchronous analysis, achieve cross scale evaluation from nanofilm/heterojunction interfaces to 3D packaging structures.
Modular System Architecture: Integration of Excitation, Loading, Detection, Imaging, and Evaluation
| Single pulse energy | 1 mJ @ 1030 nm |